Apple is reportedly set to re-engage with Intel, not for CPUs as in the past, but for manufacturing its own System-on-Chips (SoCs) using Intel’s cutting-edge lithography nodes. According to a leak published by Jukan, Apple has allegedly reached an agreement with Intel in December 2025 to produce the future M7 for MacBooks on the Intel 18A-P node, expected around late 2027. Additionally, an A21 SoC for the iPhone is slated for production on Intel 14A by the end of 2028. Is the blue team reclaiming leadership?
While there has been no official announcement from Apple yet, this leak aligns with a clear strategy: to lessen dependence on TSMC during a period of overwhelming demand for the Taiwanese manufacturer, and as Apple’s preferential status diminishes.
Apple Shifts from TSMC to Intel for M7 and A21 Manufacturing on Intel 18A-P and Intel 14A
Until now, Apple has built its entire advantage in Apple Silicon in partnership with TSMC, which held absolute priority for the Taiwanese foundry. The M-series SoCs for Mac, A-series for iPhone, and a significant portion of their efficiency strategy originate from TSMC. However, the issue is that TSMC also manufactures for AMD, NVIDIA, Qualcomm, MediaTek, and a large part of the industry. When advanced capacity is strained, having a secondary manufacturing route becomes a necessity. And if your privileged negotiation position weakens because another company is more lucrative for the chip manufacturer, alternatives must be sought.
Specifically, for the M7 SoC destined for MacBooks, the leak points to the yet-to-debut Intel 18A-P node. This node is expected to be an enhanced version of Intel 18A, designed to offer improved performance and efficiency margins. The underlying technical foundation is already known from its original process, namely RibbonFET and PowerVia.
RibbonFET is Intel’s gate-all-around transistor architecture, while PowerVia (BSDPN) routes electrical power to the rear of the chip, freeing up space on the front and enhancing power delivery. Intel positions this as a key combination for power-efficient SoCs, which aligns well with the needs of a MacBook, especially considering developments seen with Panther Lake.
iPhones to Feature Intel’s Advanced Technology to Compete with Qualcomm
The most striking development would be for the iPhone scheduled for release in 2028. According to this information, Apple will utilize Intel 14A for the A21 and A21 Pro chips, with production commencing in late 2028. This involves a more ambitious node, significantly more advanced than what TSMC is expected to offer. It will feature RibbonFET 2 (Forksheet), PowerDirect, and Turbo Cells.
To provide context, PowerDirect would be Intel’s second-generation backside power delivery system, essentially PowerVia 2. RibbonFET 2 would improve the transistor component, and Turbo Cells would allow for the integration of faster and more efficient cells within the same design. Intel also links 14A with ASML’s High-NA EUV, a more advanced lithography technique for printing smaller structures on transistors.
This does not imply that Apple will abandon TSMC entirely; in fact, it’s possible that other products will continue to use TSMC’s lithography nodes. The most likely scenario is a diversified manufacturing strategy: TSMC will maintain production of the most critical SoCs, while Apple leverages Intel Foundry to diversify capacity, mitigate risks, and gain negotiation leverage.
For Intel, this would represent an enormous showcase. Manufacturing an M7 and an A21 SoC would place Intel Foundry exactly where it has been striving to return for years: at the forefront of advanced nodes. If this report is confirmed and ceases to be a mere leak, Intel’s standing in the industry is set to rise significantly.
