Technology News

China's DFSX TY64 SuperNode Achieves Nearly Double the Bandwidth of NVIDIA's GB200 NVL72

August 4, 2026Carlos Mendoza2 мин

China is heavily investing in its domestic industry to achieve technological independence from the United States and other nations. The Asian giant aims to manufacture its own chips, and while US restrictions have made this challenging, they haven't halted progress. In fact, China continues to surprise, now achieving double the memory bandwidth of NVIDIA's GB200 NVL72 using the DFSX TY64 SuperNode.

Among global powers, the US fears China most, particularly in the technology and industry sectors, knowing China could potentially surpass it if left unchecked. This is why, at the dawn of the AI era, the US was the first to implement restrictions and sanctions against China, preventing them from acquiring advanced AI chips and the necessary manufacturing machinery, including from ASML.

China Achieves Nearly Double NVIDIA's Bandwidth with its DFSX TY64 SuperNode

Instead of settling for outdated technologies and chips, China's government has been dedicated to boosting the nation's industry and fostering advancement. While China may not yet match the US in chip performance, efficiency, or nanometer processes, it is excelling in other areas. Following Huawei's surpassing Intel's 18A node in density, DFSX's SuperNode TY64 now demonstrates superior bandwidth compared to NVIDIA's GB200 NVL72 system.

For context, the GB200 NVL72 is an NVIDIA rack server housing 72 interconnected GB200 GPUs alongside 36 Grace CPUs, engineered for exascale AI training and inference. Even this cutting-edge system has been outmatched by China's latest DFSX creation. This development follows DFSX's recent announcement as the first to create a 3.5D chiplet named DF1000 with 3D DRAM, showcasing rapid innovation.

Despite Reaching 960 TB/s Bandwidth, Performance is Significantly Slower Than GB200 NVL72

The DFSX TY64 SuperNode is comprised of 14nm DF2000 chips featuring stacked 3D DRAM architecture. This design fuses copper vias directly onto the wafer, eliminating wires and micro-contacts. This allows each DF2000 chip to achieve a bandwidth of 15 TB/s. The SuperNode TY64 version reaches an impressive 960 TB/s, nearly double NVIDIA's GB200 NVL72 at 576 TB/s.

However, while China has surpassed NVIDIA in this specific metric, it lags significantly in overall performance and efficiency. This is attributed to the difference in manufacturing processes, with 14nm technology for the SuperNode TY64 versus 4nm for the GB200 NVL72. Consequently, the TY64 offers 64 PFLOPs compared to the GB200 NVL72's 360 PFLOPs.