Intel Nova Lake-S: Dual Base Tile SKUs, Xe3P APU, and Dedicated Graphics Power

Intel's Nova Lake-S processors are once again surfacing in leaks, with new insights from prominent leakers clarifying the SKU lineup. A significant revelation is that several models previously thought to be Dual Base Tile (DBT) configurations will actually be Single Base Tile (SBT) variants. Furthermore, a distinct PC APU model is emerging, boasting an Xe3P integrated GPU with 12 Xe-cores and dedicated dual power phases for its graphics component within the Nova Lake-S architecture.

The core distinction lies in separating the underlying silicon configurations (Base Tiles) from the commercially released SKUs, which are derived through binning, core disabling, and TDP adjustments. Initial leaks had somewhat blurred this distinction, and recent updates are refining this understanding.

Intel Nova Lake-S to Debut with Only Two Dual Base Tile SKUs

The leaked documentation, when properly interpreted, paints a picture of Intel's upcoming PC gaming lineup for late this year or early next. The initial filtration identified five clear base configurations:

• 8 Cores with Single Base Tile: 4 P-Cores + 0 E-Cores
• 16 Cores with Single Base Tile: 4 P-Cores + 8 E-Cores
• 28 Cores with Single Base Tile: 8 P-Cores + 16 E-Cores
• 28 Cores with Single Base Tile and bLLC: 8 P-Cores + 16 E-Cores
• 52 Cores with Dual Base Tile and bLLC: Dual configuration of 8 P-Cores + 16 E-Cores

While these base configurations are robust, the true market differentiation lies in the final SKUs. However, a previous leak contained an error, suggesting a 28-core Core Ultra 9 (P2D model) with a Dual Base Tile configuration (8P+16E+4LP-E cores) at 125W. This is now corrected: there will be no DBT version for this specific configuration; it is an SBT. The P2D model, however, will feature bLLC cache.

Intel Prepares an APU to Compete with AMD

The line between traditional CPUs and APUs is blurring, primarily driven by integrated graphics performance. Recent information from leaker Jaykihn suggests Intel is developing a powerful APU for the Nova Lake-S platform, which will also utilize the new LGA1954 socket, offering expanded capabilities akin to AMD's offerings.

According to the leaker, this APU will feature a configuration of 4 P-Cores + 8 E-Cores + 4 LPE Cores. Crucially, it will integrate an iGPU with 12 Xe-cores based on the Xe3P architecture. This represents an advancement, potentially incorporating Battlemage V3 features with some aspects of Celestial architecture, as previously discussed.

To support this high-performance integrated graphics, Intel has equipped these models with two dedicated VCCGT VRMs. This implies that motherboards designed for these APUs will need to feature two dedicated power phases specifically for graphics. This APU is expected to be the sole Nova Lake model featuring this particular iGPU.

This configuration is believed to be the one with the large GPU Tile observed in earlier slides, signaling Intel's intention to directly challenge upcoming AMD Ryzen 11000G processors, which are anticipated to feature Zen 6 cores and RDNA 3.5 integrated graphics.

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This article was originally published on El Chapuzas Informático.